ACTIVE-LIT – Automated testing solution system allows non-contact failure inspection of semiconductor material during the manufacturing process. Inhomogeneous temperature distribution, local power loss can be measured with Lock-in Thermography. This is achieved by using the shortest measurement times combined with a high-performance thermographic camera and a specialised lock-in procedure.
The power supply for this process is clocked with a synchronisation module and failures that produce mK or even μK differences are reliably detected.
Smallest defects like point and line shunts, oxide failures, transistor and diode failures on a PCB surface and in IC´s can be detected and displayed in x and y positions. Additionally, it is possible to analyse stacked-die packages or multi-chip modules in z-direction with merely changing the lock-in frequency.