In the field of materials testing, other methods can be used in addition to infrared thermography in order to analyse, for example, displacements and mechanical deformations of material samples and components parallel to thermal changes. Together with GOM InfraTec presents the possibilities of thermographic measurement and digital image correlation.
ARAMIS enables with its digital image correlation (DIC) functionalities the analysis of displacements and mechanical deformations of material specimens and components. In combination with thermography measurements, the thermal specimen behavior can be evaluated together with the mechanical deformation.
This webinar will discuss the combination of GOM ARAMIS DIC evaluations with thermography measurements using IR cameras from InfraTec.
With the unique software feature in ARAMIS, you can analyze the correlation between mechanical and thermal deformations in detail and speed up your development time thanks to the comprehensive understanding obtained about your materials or components.
Topics in this webinar:
- Synchronizing high-tech sensors: GOM ARAMIS and InfraTec IR cameras
- Tracking of temperature on homologous points in 3D space
- Applications in materials and components testing