The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperature measuring data from infrared cameras enables the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field.
GOM ARAMIS – Digital Image Correlation (DIC)
The ARAMIS system measures by using a contact-free and material-independent method based on the principle of digital image correlation.
The images of the test specimens under load that were recorded with high-resolution cameras or high-speed cameras are evaluated. The system determines the gray value distribution for thousands of subsections in each camera image and gives the subpixel-accurate positions of the corresponding measuring points in all images, from which then the 3D coordinates are calculated by triangulation.
The evaluation of this surface information for all load levels during the time in the 3D space delivers the exact X, Y and Z displacements, velocities and accelerations. Furthermore, ARAMIS determines from the 3D coordinates the surface strains, such as, major and minor strain.
Proceeding from these measuring data, material parameters are determined, numerical simulations are validated and component motions and deformations are analyzed. The ARAMIS system can be used for specimen sizes in the range from several square millimeters to several square meters and supports both high-definition and high-speed cameras with frame rates up to more than 1,000,000 Hz.
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