Current Appointments
- Infrared Lock-in Thermography for Inspection of Electronics and Integrated Circuits (english)Virtual
Date
2026-11-04, 09:00 GMT – 11:00 GMTRegister now
Lock-in Thermography for Electronics – Detect Failures, Ensure Quality
The inspection of electronic components and assemblies by using active thermography is an established method for troubleshooting and quality assurance – from prototype development to series production.
In particular the lock-in thermography provides highly detailed information during each development step. This information can be essential for the design of complex electronic circuits or assemblies to optimise the thermal management. Active thermography is applied especially in electronics production as a versatile tool: for example, in quality assurance, for permanent monitoring of technological parameters as well as for inline inspection of products in manufacturing.
Learn more about the use of lock-in thermography for failure analysis in electrical engineering and electronics in our free of charge online event Infrared Lock-in Thermography for Inspection of Electronics and Integrated Circuits.
A Glimpse at the Online Event
Failure analysis and defect inspection
Quality and process control
Flexible R&D solution
Basic configuration to turnkey solution
Hotspot detection on printed circuit boards, integrated circuits, semiconductor material and multi-chip modules
Detection of faulty thermal connections of heat sinks, short circuits, soldering defects and wire bonding errors
Complementary Technical Lecture
Title: Theory and Practice of Lock-in Thermography
Speaker: Stephan Larmann, Application Engineer, InfraTec GmbH
