Press Releases of InfraTec

Modern electronic circuit boards and electronic components enable ever-increasing data transfer volumes and faster processing speeds. As a result, power consumption and heat generation often increase, which frequently leads to warping of the mounting board. In addition, many electronic devices using these components are exposed to changing environmental conditions, which can cause connection failures due to deformation of the mounting board and similar effects. Researchers at ESPEC CORP., Japan, have developed a combined method of 3D digital image measurement (DIC) and thermography to measure thermal stress-induced deformation of components as early as the design phase.

In our free of charge InfraTec online event „Micro-Thermography – Contactless Temperature Measurement in the Micrometer Scale“, you will learn everything you need to know about the basics and possibilities of micro-thermography. Our experts will provide practical tips on how to use this method efficiently to address your specific challenges.

For more than ten years, InfraTec has been offering infrared cameras with motorized zoom, which can perform thermography on objects even over long distances. By using a so-called teleextender, which is now also available for ImageIR® 6300 Z, the range of the cameras can be increased by about 1.5 times. The minimum working distance required between the camera and the test object (minimum focusing distance) increases only slightly, which is particularly advantageous.

Our free of charge InfraTec online event "Thermographic Analysis of Mechanical Processes" offers you insights in using thermography for process control and for researching friction processes.

As part of the “C2Land” project researchers at the Technical University of Braunschweig have developed an optical reference system consisting of a VIS and an infrared camera that enables safe autonomous landing. Specially programmed image processing software can be used to determine the exact position of the aircraft relative to the runway.