Analysing electronic components the ISIT has to detect smallest possible temperature differences. It does so by using the thermal camera ImageIR® 8300 from InfraTec which can precisely measure temperature differences of 20 mK securely identifying any even just emerging thermal issue. Thus, development failures can be avoided at an early stage. By using a detec-tor with (640 x 512) IR pixels at a 15 µm pitch and a high performance 3x microscopic lens a geometric reso-lution of only 5 µm can be achieved. At the same time, a field of view of (3.2 x 2.6) mm2 is displayed which is suitable for many microelectronic applications. Additional, easily interchangeable lenses with a range of focal lengths enable the ISIT to further exploit the flexibility of their infrared camera across a wide variety of applications.

Inverter with loaded components to forecast their lifecycle

Another benefit for the ISIT derives from the precision calibration of the ImageIR® 8300 camera. The use of a set of additional side calibration curves compensates for drift and ensures a maximum measurement accuracy even under fluctuating measurement conditions. As with all thermographic testings of electronic components and circuits, measurements are influenced by the differing emissivity of the individual components. To overcome this situation, InfraTec offers an automated pixel wise emissivity correction routine directly in its control and analysis software IRBIS® 3. Using these tools precise statements can be made about temperature distributions and developments over time. With the time component of the heating playing an increasingly important role in the ever decreasing sizes of components, the ISIT is able to take advantage of the multi-kHz frame rates possible with the ImageIR® 8300.

Infrared camera ImageIR® 8300 Series from InfraTec

InfraTec Solution

Fraunhofer Institute for Silicon Technology (ISIT)
25524 Itzehoe

Infrared camera: ImageIR® 8300

Relevant Industries & Applications

  • microthermography


    Micro-thermography allows for the thermal analysis of extremely small structures in the micrometer range, providing a detailed representation of the temperature distribution on complex electronic assemblies and components.