Thermal Optimisation of Components and Assemblies
Improve product features and process characteristics based on energy optimisation
- Thermal images allow for detailed analysis of heat developments of components and processes
- Hot spots may indicate faults and room for optimization
- High number of pixels of infrared cameras prevent risk of wrong measurements
Heat as One Important Energy Factor Can Be Controlled
Case Studies about Thermal Optimisation
Optimisation of Components or Processes by Heat Input or Drainage
If thermal imaging indicates hot spots at a PCB there are temperatures with a specially high temperature and this could indicate problems. If this is a normal temperature the heat drainage might still be improvable. Like this overheating of components or bordering components could be prevented. To detect the hot-spots a sufficient geometrical resolution is crucial. Only details which are well resolved by a sufficient number of pixels can be measured correctly. Therefore high-resolution infared camera systems by InfraTec are first choice for usage in product development.
Heating of a heating coil
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